Vacuum High Temperature Test Chamber
Features of vacuum high temperature test chamber: special high temperature equipment for defoaming and anti-oxidation. And it meets the standards: GB/T2423.1 (IEC60068-2-1), GB/T2423.2 (IEC60068-2-2), ISO16750; JESD22, GB/T 14710, GB/T 13543.
First, product overview of vacuum high temperature test chamber:
New and simple design;
The program of automatic control of pressure and temperature control is easy to operate and advanced in function;
Observation window for easy observation of test material status (optional);
Dual structure in the chamber: the inside of the vacuum container has a dual structure of an inner slot, and a heater is set outside the inner chamber to reduce heat loss, improve temperature uniformity, greatly shorten the temperature rising time, and improve the operating rate of the equipment;
Widely used: can be used for defoaming, degassing, hardening, drying and so on;
Resin liquid mixing and silicone liquid when the defoaming treatment in LED production process, various resin molding degas treatment, IC injection of epoxy resin hardening treatment, drying for electronic parts after water cleaning, vacuum high temperature test chamber can be used in all these process;
Second, different models of vacuum high temperature test chamber:
Model number
Temperature range
Internal volume
Type
Internal size
(W*H*Dmm)
External size
(W*H*Dmm)
VAC-101P
+40～+200℃
91L
Atmospheric pressure range：933～1[*102Pa](abs)
450×450×450
902×1,392×780
VAC-201P
+40～+200℃
216L
Atmospheric pressure range：933～1[*102Pa](abs)
600×600×600
1,052×1,532×930
VAC-301P
+40～+200℃
512L
Atmospheric pressure range：933～1[*102Pa](abs)
800×800×800
1,252×1,772×1,130
Model number
Temperature/pressure range
Internal size
(W*H*Dmm)
LCV-234
(RT+20)°C~+200°C / 0-101kPa(Gauge)
450×450×450
LCV-244
550×550×550
Clean Hot Air Circulation Oven
Hot air circulation oven is a universal drying equipment with a long history, which has a wide range of application, uniform temperature, high thermal efficiency and simple operation. It is one of the necessary drying equipment for most pharmaceutical and related enterprises, and is also a popular drying equipment for users.
Based on years of actual production experience and existing production technology, combined with the current national pharmaceutical industry GMP requirements, our company designed the oven that is higher than the current national GMP standard requirements for the pharmaceutical industry - clean oven, its technical characteristics are described as follows:
1, Equipment materials: internal and external walls are SUS304 stainless steel, the internal cavity is full of welding, rounded transition, making the oven without wind phenomenon in the working state, and making the equipment easy to clean, no water seepage phenomenon in the heat preservation layer, to ensure that the cleanliness of the items dried each time. The external wall is made of brushed board making the outer surface of the oven is flat, smooth, beautiful, no visible concavity and convexity;
2, Circulating fan impeller, volute shell are made of stainless steel, to ensure clean circulating air; selection of large air volume, high air pressure centrifugal fan as a circulating fan for forced ventilation, which can speed up the drying speed of the material to ensure the uniformity of material drying.
3, The drying oven air inlet is divided into two levels of filtration, the new air inlet for the intermediate filter, making the new air up to 300,000, after heating each cycle of hot air with high-temperature high efficiency filter filtration, so that the hot air into the drying oven are more than 10,000 levels of cleanliness, to ensure that the drying process of cleanliness;
4, The system is equipped with all stainless steel moisture exhaust fan, and the system's PLC program module collects the humidity in the system for intelligent control: According to the signal provided by the humidity control instrument, the damper actuator of the humidification port is controlled by the damper. At the same time, the damper is controlled by the frequency converter to output the corresponding frequency according to the size of the humidity signal, and the reasonable air volume is discharged to achieve the best humidification effect and achieve reasonable humidification. The moisture outlet is equipped with a medium effect filter to ensure the cleanliness of the return air of the moisture outlet.
5, Oven heating form: steam or electric heating. The material is stainless steel. Its has good heat dissipation effect and sanitary conditions. The fluctuation range is about ±1℃;
6, The circulatory system stroke from both sides of the main machine into the same time, concentrated to the middle exhaust air, compared with the conventional design to reduce the temperature difference between the left and right sides of the oven; According to the guiding rules of the air volume and air pressure of the air inlet and air outlet, multiple groups of punching plates with different ratios are designed as the distribution device of the inward hot air to achieve a smaller temperature difference. Moreover, the fixing method of the air equalizing network board and the main engine adopts the quick fixing method, which can quickly clean the inlet and outlet air duct to ensure the cleanliness of the chamber;
7, The equipment is designed with 5 sewage outlets in the air inlet, skip and air outlet, which can ensure that all the sewage is discharged quickly after cleaning. The five sewage outlets are gathered into a main pipe for centralized discharge, reducing the total sewage outlet, so that the plant can open less floor drains;
8, The equipment in the inlet and outlet duct design can cover the entire system of 7 online cleaning ports, in normal circumstances to achieve fast and simple online cleaning function, can also be directly set up online cleaning device, in order to achieve the true meaning of CIP;
9, The oven track is convex splints, and the bottom plate is connected by round foot welding, and the drying car is equipped with inclined pedal, which makes the drying car easy to enter and exit; At the same time reduce the dead Angle without affecting the blowdown performance; Stainless steel square tube is used for the column and stainless steel Angle steel is used for the beam of the oven, and argon arc welding is adopted. Wheels with high temperature resistant nylon wheels, each dryer with 2 directional wheels, 2 steering wheels. The whole dryer has reasonable structure, high strength, beautiful and practical;
10, The equipment heating system (heater, high temperature and high efficiency filter) is concentrated in the closed stainless steel chamber, good insulation effect, high cleanliness, and high temperature and high efficiency filter for the drawer type fast loading structure, can be cleaned and replaced quickly; The connecting parts and the system are connected with the adjustable screw quick installation design, which is convenient for maintenance and overhaul;
11, The oven door lock adopts advanced adjustable elastic door lock, good locking performance, easy to operate. High temperature and non-toxic silicone rubber sealing ring is used between the door and the box, which has excellent sealing performance. The insulation layer of the oven adopts ultra-fine glass wool, which has good thermal insulation performance.
12, All the round flanges in the system are connected by quick-opening clamp, and the method is designed by quick-mounting butterfly screws, which facilitates the disassembly and cleaning of the pipeline;
13, There are two quick verification ports on the equipment host, which is convenient to verify the temperature and humidity during the working process.
New Energy Environment Test Solution
The problem of new energy reliability is still difficult, and the integrated detection system of electrical stress and environmental stress will provide the best means for research and development and manufacturing.
Industry
Test object
Use
Technology
Solution
New Energy
Battery (secondary battery)
Inspect
Charge and discharge test
High and low temperature (&humidity) test chamber
Rapid temperature (&humidity)change test chamber
Evaluate
Characteristic test
Rapid temperature (&humidity)change test chamber
Fuel cell
/
Temperature resistance
Small ultra-low temperature test chamber
High and low temperature (&humidity) test chamber
Rapid temperature (&humidity)change test chamber
Information Communication Environment Test Solution
The statistical analysis shows that the failure of electronic components accounts for 50% of the failure of electronic complete machine, and the reliability detection technology still faces many challenges.
Industry
Test object
Use
Technology
Solution
IT Communication
Transmission switching equipment
Inspect
High temperature placement test
High and low temperature (&humidity) test chamber
Aging test
High and low temperature (&humidity) test chamber
Evaluate
Thermal cycling test
High and low temperature (&humidity) test chamber
Tellcordia test
High and low temperature (&humidity) test chamber
Thermal cycling test
Rapid temperature (&humidity)change test chamber
Mobile communication terminal
Inspect
Finished operation test
High and low temperature (&humidity) test chamber
Finished operation test
Rapid temperature (&humidity)change test chamber
Evaluate
Temperature and humidity test
High and low temperature (&humidity) test chamber
Computer
Inspect
Finished product screening
Rapid temperature (&humidity)change test chamber
High temperature placement test
High and low temperature (&humidity) test chamber
Aging test
High and low temperature (&humidity) test chamber
External computer storage device
Inspect
Component screening
High and low temperature (&humidity) test chamber
Component screening
Rapid temperature (&humidity)change test chamber
Evaluate
Ensure operation test within temperature and humidity range
High and low temperature (&humidity) test chamber
Ensure operation test within temperature and humidity range
Rapid temperature (&humidity)change test chamber
Environmental Test Solutions for Electronic Products
The statistical analysis shows that the failure of electronic components accounts for 50% of the failure of electronic complete machine, and the reliability detection technology still faces many challenges.
Industry
Test object
Use
Technology
Solution
Electronic products
Semiconductor
Evaluate
Evaluation of adhesion between equipment and substrate
Rapid temperature (&humidity)change test chamber
Printed circuit board
Manufacture
Hardening and drying of insulating coatings
High temperature test chamber
Accelerated thermal cycling test
Rapid temperature (&humidity)change test chamber
Low temperature placement test
Rapid temperature (&humidity)change test chamber
LED
Evaluate
High temperature test
High temperature test chamber
Temperature cycling test
High and low temperature (&humidity) test chamber
Temperature cycling test
Rapid temperature (&humidity)change test chamber
Magnetic material
Manufacture
Drying
High temperature test chamber
/
High and low temperature (&humidity) test chamber
Battery
Evaluate
Characteristic test
Rapid temperature (&humidity)change test chamber
Environmental Test Solutions For Mechanical And Electrical Products
The statistical analysis shows that the failure of electronic components accounts for 50% of the failure of electronic complete machine, and the reliability detection technology still faces many challenges.
Industry
Test object
Use
Technology
Solution
Electromechanical
System component
Evaluate
Thermal cycling test
High and low temperature (&humidity) test chamber
Thermal cycling test
Rapid temperature (&humidity)change test chamber
Electric gas
Evaluate
Thermal cycling test
High and low temperature (&humidity) test chamber
Thermal cycling test
Rapid temperature (&humidity)change test chamber
Railway traffic
Evaluate
Thermal cycling test
High and low temperature (&humidity) test chamber
Thermal cycling test
Rapid temperature (&humidity)change test chamber
/
High and low temperature (&humidity) test chamber
/
Small ultra-low temperature test chamber
Environmental test Solutions for Vehicle Transport Auto Parts
The reliability of vehicle transportation auto parts products is very important, which directly determines the safety, reliability and operation comfort of the vehicle.
Industry
Test object
Use
Technology
Solution
Automobile industry
Automotive electronics
Inspect
High and low temperature test
High and low temperature (&humidity) test chamber
Evaluate
High and low temperature test
High temperature test chamber
Condensation power test
Rapid temperature (&humidity)change test chamber
Characteristic test
Rapid temperature (&humidity)change test chamber
Car battery
Inspect
Charge and discharge test
High and low temperature (&humidity) test chamber
Evaluate
Characteristic test
Rapid temperature (&humidity)change test chamber
Walking safety device
Inspect
Aging of the substrate
High and low temperature (&humidity) test chamber
Evaluate
Characteristic test
High temperature test chamber
Occupant protection (air bag)
Inspect
Finished product screening
Rapid temperature (&humidity)change test chamber
Car driving guidance system
Inspect
Finished product screening
High and low temperature (&humidity) test chamber
Rapid temperature (&humidity)change test chamber
ETC vehicle operation system
Inspect
High and low temperature test
High and low temperature (&humidity) test chamber
High temperature test chamber
Evaluate
Characteristic test
Rapid temperature (&humidity)change test chamber
Other automotive associations (power semiconductors)
Place at high temperature
High temperature test chamber
Battery Special Test Chamber
Introduction to the test chamber of battery special test chamber:
High and low temperature (& humidity) environment test for lithium battery cells, modules and electric vehicle power battery pack test; It is also used for high and low temperature (wet and hot) environmental tests of lithium battery cells and modules related to energy storage industry.
Main parameters of battery special test chamber:
Studio size: 0.3m ~ 1.5m³(other sizes can be customized)
Temperature range: -40 ℃ ~ +150℃
Humidity range: 20% ~ 98%
Heating rate: 1℃ -5 ℃/min (The whole process)
Cooling rate: 1℃ -5 ℃/min (The whole process)
Temperature fluctuation: ±0.5
Temperature uniformity: 2℃
Temperature deviation: ±2℃
Humidity deviation: +2 ~ -3% (> 75%RH), ± 5% (≤ 75%RH)
The Comprehensive Chamber of Temperature, Humidity, Height and Vibration
The comprehensive chamber of temperature, humidity, height and vibration is suitable for aviation, aerospace, weapons, ships, nuclear industry and other information electronic instruments, all kinds of electronic machines, parts and components, as well as materials, processes, etc. in temperature, humidity, height (≤30000 meters) and vibration and other climatic environment and mechanical environment simulation test and comprehensive environmental test of the combination of factors.
Main parameters of the comprehensive chamber of temperature, humidity, height and vibration:
Effective size of the studio: D1200×W1200×H1000mm (other sizes can be customized)
Temperature range: -70℃ ~ +150℃
Humidity range: 20% ~ 98%(atmospheric pressure condition, highly comprehensive test is adjusted)
Heating time: ≥10℃/min (-55℃ ~ +85℃, atmospheric pressure, 150kg aluminum)
Cooling time: ≥10℃/min (-55℃ ~ +85℃, atmospheric pressure, 150kg aluminum)
Air pressure range: normal pressure ~ 0.5kPa
Sinusoidal and random excitation force: 100kN
Maximum acceleration: 100g
Frequency range: 5 ~ 2500Hz
Working surface: φ640mm
Comprehensive test capacity:
► Temperature + humidity comprehensive test:
Temperature range: +20℃ ~ +85℃; Humidity range: 20% ~ 98%.
► Temperature + height comprehensive test:
Temperature range: -55℃ ~ +150℃; Height range: ground ~ 30000m.
► Temperature + humidity + height comprehensive test:
Temperature range: +20℃ ~ +85℃; Humidity range: 20% ~ 95%(the highest humidity is highly correlated); Height range: ground ~ 15200m. Some parameters can be further expanded according to the specific requirements of the comprehensive test.
►Temperature + humidity + height + vibration comprehensive test:
Temperature range: +20℃ ~ +85℃; Humidity range: 20% ~ 95%(the highest humidity is highly correlated); Height range: ground ~ 15200m, vibration parameters correspond to vibration table specifications. Some parameters can be further expanded according to the specific requirements of the comprehensive test.
The comprehensive chamber of temperature, humidity, height and vibration meets the standard:
►GB/T2423.1 Test A: Low temperature test method
►GB/T2423.2 Test B: High temperature test method
►GB/T2423.3 Constant temperature and humidity test
►GB/T2423.4 alternating temperature and humidity test
►GB/T2423.21 low pressure test method
►GB/T2423.27 Low temperature low pressure and humidity continuous comprehensive test
►GJB150.2A Low pressure (altitude) test
►GJB150.3A high temperature test
►GJB150.4A low temperature test
►GJB150.9A temperature and humidity test
►GJB150.24A temperature - humidity - vibration - height test
►GJB150.2 Military equipment environmental test method Low pressure test
►GJB150.6 military equipment environmental test method temperature-height test;
►GJB150.19 Military equipment environmental test method temperature - height - humidity test;
►RTCA-DO-160 related test requirements;
Vibration Of The Comprehensive Chamber
Vibration of the comprehensive chambers reproduce the use environment of electronic instruments, auto parts, ships, aerospace and other industry products, to achieve temperature, humidity, vibration comprehensive composite test.
● Functional Features of vibration of the comprehensive chamber
According to the purpose of the test, the setting place and the fixing method of the sample, a reasonable matching mode between the test chamber and the shaking table should be selected. The test chamber and shaking table can be combined to carry out compound test, or test separately.
● Product application of vibration of the comprehensive chamber
Vibration of the comprehensive chambers are mainly used in aviation, aerospace, ships, weapons, electrical, electronic, automobile and automobile parts, motorcycles, communications, scientific research institutes, metrology and other industries to determine electrical and electronic products, instruments or other equipment in the transport, storage, use of reliability test. It is mainly made of temperature and humidity test chamber with corresponding vibration table, which can independently complete the corresponding temperature, humidity, vibration test (vertical and horizontal direction) and the combination test of three factors.
Burn-in Testing
Burn-in testing is the process by which a system detects early failures in semiconductor components (infant mortality), thereby increasing a semiconductor component reliability. Normally burn-in tests are performed on electronic devices such as laser diodes with an Automatic Test Equipment laser diode burn-in system that runs the component for an extended period of time to detect problems.
A burn-in system will use cutting-edge technology to test the component and provide precision temperature control, power and optical (if required) measurements to ensure the precision and reliability required for manufacturing, engineering evaluation, and R&D applications.
Burn-in testing may be conducted to ensure that a device or system functions properly before it leaves the manufacturing plant or to confirm new semiconductors from the R&D lab are meeting designed operating requirements.
It is best to burn-in at the component level when the cost of testing and replacing parts is lowest. Burn-in of a board or an assembly is difficult because different components have different limits.
It is important to note that burn-in test is usually used to filter out devices that fail during the “infant mortality stage” (beginning of bathtub curve) and does not take into count the “lifetime” or wearout (end of the bath tub curve) – this is where reliability testing comes into play.
Wearout is the natural end-of-life of a component or system related to continuous use as a result of materials interaction with the environment. This regime of failure is of particular concern in denoting the lifetime of the product. It is possible to describe wearout mathematically allowing the concept of reliability and, hence, lifetime prediction.
What Causes Components to Fail During Burn-in?
The root cause of fails detected during burn-in testing can be identified as dielectric failures, conductor failures, metallization failures, electromigration, etc. These faults are dormant and randomly manifest into device failures during device life-cycle. With burn-in testing, an Automatic Test Equipment (ATE) will stress the device, accelerating these dormant faults to manifest as failures and screen out failures during the infant mortality stage.
Burn-in testing detects faults that are generally due to imperfections in manufacturing and packaging processes, which are becoming more common with the increasing circuit complexity and aggressive technology scaling.
Burn-in Testing Parameters
A burn-in test specification varies depending on the device and testing standard (military or telecom standards). It usually requires the electrical and thermal testing of a product, using an expected operating electrical cycle (extreme of operating condition), typically over a time period of 48-168 hours. The thermal temperature of the burn-in test chamber can range from 25°C to 140°C .
Burn-in is applied to products as they are made, to detect early failures caused by faults in manufacturing practice.
Burn In Fundamentally performs the following:
Stress + Extreme Conditions + Prolong Time = Acceleration of “Normal/Useful life”
Types of Burn-in Tests
Dynamic Burn-in : the device is exposed to high voltage and temperature extremes while being subjected to various input stimuli .
A burn-in system applies various electrical stimuli to each device while the device is exposed to extreme temperature and voltage. The advantage of dynamic burn-in is its ability to stress more internal circuits, causing additional failure mechanisms to occur. However, dynamic burn-in is limited because it cannot completely simulate what the device would experience during actual use, so all the circuit nodes may not get stressed.
Static Burn-in : Device under test (DUT) is stressed at elevated constant temperature for an extended period of time.
A burn-in system applies extreme voltage or currents and temperatures to each device without operating or exercising the device. The advantages of static burn-in are its low cost and simplicity.
How is a Burn-In Test Performed?
The semiconductor device is placed onto special Burn-in Boards (BiB) while the test is executed inside special Burn-in Chamber (BIC).
Know more about Burn-in Chamber（Click here）
Burn-in Chamber
A burn-in chamber is an environmental oven used to evaluates the reliability of multiple semiconductor devices and performs large capacity screenings for premature failure (infant mortality). These environmental chambers are designed for static and dynamic burn-in of integrated circuits (ICs) and other electronic devices such as laser diodes.
Selecting Chamber Size
The chamber size depends on the size of the burn-in board, the number of products in each burn-in board, and the number of batches required per day to meet production requirements. If the interior space is too small, insufficient space between parts results in poor performance. If it is too large, space, time and energy are wasted.
Companies that are purchasing a new burn-in set-up should work with the vendor to ensure the heat source has enough steady-state and maximum capacity to match the load for the DUT.
When using forced recirculating airflow, parts benefit from spacing, but the oven can be loaded more densely vertically because airflow is distributed along the entire side wall. Parts should be kept 2-3 inches (5.1 – 7.6cm) from the oven walls.
Burn-in Chamber Design Specs
Temperature Range
Depending on the requirements of the Device Under Test (DUT) select a chamber that has a dynamic range such as 15°C above ambient to 300°C (572°F)
Temperature Accuracy
It is important that the temperature does not fluctuate. Uniformity is the maximum difference between the highest and lowest temperatures in a chamber at a specified setting. A specification of at least 1% setpoint for uniformity and 1.0°C control accuracy is acceptable in most semiconductor burn-in applications.
Resolution
A high-temperature resolution of 0.1°C will provide the best control to meet burn-in requirements
Environmental Savings
Consider a burn-in chamber that has a refrigerant that has a zero ozone layer depletion coefficient. Burn-in chambers with refrigeration are related to chambers operating in temperatures below 0 degrees Celsius down to – 55°C.
Chamber configuration
The chamber can be designed with card cages, card-slots, and access doors to simplify connecting DUT boards and driver boards with ATE stations.
Chamber Air Flow
In most cases a forced convection oven with recirculating airflow will provide the best distribution of heat and significantly speeds the time-to-temperature and heat transfer to parts. Temperature uniformity and performance depends on a fan design that directs air to all areas of the chamber.
The chamber can be design with a horizontal or vertical airflow. It is important to know the direction of inserting the DUT based on the airflow of the chamber.
Custom ATE Wiring
When it comes to measuring over hundreds of devices, inserting wires through an aperture or test hole may not be practical. Custom wiring connectors can be mounted directly to the oven to facilitate the electrical monitoring of the device with an ATE.
How A Burn-in Oven Controls Temperature
The burn-in oven uses a temperature controller executing a standard PID (proportional, integral, derivative) algorithm. The controller senses the actual temperature value versus the desired setpoint value, and issues corrective signals to the heater calling for application ranging anywhere from no heat to full heat. A fan is also used to equalize the temperature through the chamber.
The most common sensor used for accurate temperature control of the environmental oven is a Resistance Temperature Detector (RTD) which a platinum-based unit typically referred to as a PT100.
Sizing The Chamber
If you are using an existing oven, basic thermal modelling based on factors such as the oven’s thermal capacity and losses, heat-source output, and DUT mass will allow you to verify that the oven and heat source are sufficient to reach desired temperature with a thermal time constant short enough for tight loop response under the controller’s direction.
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