JEDEC, a standardization organization in the semiconductor industry, develops industrial standards in solid state electronics (semiconductor, memory), established for more than 50 years, is a global organization. The standards it has formulated are many industries take over and adopt. It's technical data are open and free of charge, only some of the data need to be charged. So you can go to the official website to register and download, the content contains the definition of professional terms, product specifications, test methods, reliability test requirements... It covers a wide range of topics.
JEP122G-2011 Failure mechanism and model of semiconductor components
Accelerated life tests are used to identify potential semiconductor failure causes in advance and estimate possible failure rates. The relevant activation energy and acceleration factor formulas are provided in this section for estimation and failure rate statistics under accelerated life tests.
Recommended equipment: high and low temperature test chamber, hot and cold shock test chamber, highly accelerated life test chamber, SIR Surface insulation resistance measurement system
JEP150.01-2013 Stress test drive failure mechanism associated with assembly of solid state surface mount components
GBA and LCC are attached to the PCB, using a more commonly used set of accelerated reliability tests to evaluate the heat dissipation of the production process and product, to identify potential failure mechanisms, or any reason that may cause error failure.
Recommended equipment: high and low temperature test chamber, hot and cold shock test chamber, highly accelerated life test chamber
JESD22-A100E-2020 Cycle temperature and humidity bias surface condensation life test
Test the reliability of non-sealed solid state devices in humid environments through temperature cycling + humidity + current bias. This test specification adopts the method of [temperature cycling + humidity + current bias] to accelerate the penetration of water molecules through the external protective material (sealant) and the interface protective layer between the metal conductor. Such a test will cause condensation on the surface. It can be used to confirm the corrosion and migration phenomenon of the surface of the product to be tested.
Recommended equipment: high and low temperature test chamber
JESD22-A101D.01-2021 Steady-state temperature and humidity bias life test
This standard defines the methods and conditions for performing temperature-humidity life tests under applied bias to assess the reliability of non-airtight packaged solid-state devices (e.g., sealed IC devices) in humid environments.
High temperature and humidity conditions are used to accelerate moisture penetration through external protective materials (sealants or seals) or along the interface between external protective coatings and conductors and other through parts.
Recommended equipment: high and low temperature test chamber
JESD22-A102E-2015 package IC unbiased PCT test
To evaluate the integrity of non-airtight packaged devices against water vapor in a condensed or saturated water vapor environment, the sample is placed in a condensed, high-humidity environment under high pressure to allow water vapor to enter the package, exposing weaknesses in the package, such as delamination and metallization layer corrosion. This test is used to evaluate new package structures or updates of materials and designs in the package body. It should be noted that there will be some internal or external failure mechanisms in this test that do not match the actual application situation. Since absorbed water vapor reduces the glass transition temperature of most polymer materials, an unreal failure mode may occur when the temperature is higher than the glass transition temperature.
Recommended equipment: Highly accelerated life test chamber
JESD22-A104F-2020 Temperature cycle
The temperature cycle (TCT) test is the reliability test of the IC part subjected to extremely high temperature and extremely low temperature, back and forth temperature conversion between the test, the IC part is repeatedly exposed to these conditions, after the specified number of cycles, the process is required to specify its temperature change rate (℃/min), in addition to confirm whether the temperature is effectively penetrated into the test product.
Recommended equipment: thermal shock test chamber
JESD22-A105D-2020 Power and temperature cycle
This test is applicable to semiconductor components affected by temperature. In the process, the test power supply needs to be turned on or off under the specified high and low temperature difference conditions. The temperature cycle and power supply test are to confirm the bearing capacity of the components, and the purpose is to simulate the worst situation that will be encountered in practice.
Recommended equipment: thermal shock test chamber
JESD22-A106B.01-2016 Temperature shock
This temperature shock test is carried out to determine the resistance and impact of semiconductor components to sudden exposure to extreme high and low temperature conditions. The temperature change rate of this test is too fast to simulate the real actual use. The purpose is to apply more severe stress on semiconductor components, accelerate the damage of their vulnerable points, and find out the possible potential damage.
Recommended equipment: thermal shock test chamber
JESD22-A110E-2015 HAST highly accelerated life test with bias
According to JESD22-A110 specifications, both THB and BHAST are used to test components at high temperature and humidity, and the test process needs to be biased to accelerate the corrosion of components. The difference between BHAST and THB is that they can effectively shorten the test time required for the original THB test
Recommended equipment: Highly accelerated life test chamber
JESD22A113I plastic surface mount device prior to reliability testing
For non-enclosed SMD parts, pre-treatment can simulate the reliability problems that may occur during the assembly of the circuit board due to the damage caused by packaging moisture, and identify potential defects in the reflow assembly of SMD and PCB through the test conditions of this specification.
Recommended equipment: high and low temperature test chamber, hot and cold shock test chamber
JESD22-A118B-2015 Unbiased high-speed accelerated life test
To evaluate the resistance of non-airtight package components to moisture under non-biased conditions, confirm their moisture resistance, robustness and accelerated corrosion and aging, which can be used as a test similar to JESD22-A101 but at a higher temperature. This test is a highly accelerated life test using non-condensation temperature and humidity conditions. This test must be able to control the rising and cooling rate in the pressure cooker and the humidity during cooling
Recommended equipment: Highly accelerated life test chamber
JESD22-A119A-2015 Low temperature storage life test
In the case of no bias, by simulating the low temperature environment to assess the ability of the product to withstand and resist low temperature for a long time, the test process does not apply bias, and the electrical test can be carried out after the test is returned to normal temperature
Recommended equipment: high and low temperature test chamber
JESD22-A122A-2016 Power cycle test
Provides standards and methods for solid-state component package power cycle testing, through biased switching cycles that cause uneven temperature distribution inside the package (PCB, connector, radiator), and simulates standby sleep mode and full load operation, as well as life cycle testing for associated links in solid-state component packages, This test complements and augments the results of the JESD22-A104 or JESD22-A105 tests, which cannot simulate harsh environments such as engine rooms or aircraft and space shuttles.
Recommended equipment: thermal shock test chamber
JESD94B-2015 Application-Specific qualifications use knowledge-based testing methods
Testing devices with correlated reliability testing techniques provides a scalable approach to other failure mechanisms and test environments, and life estimates using correlated life models
Recommended equipment: high and low temperature test chamber, hot and cold shock test chamber, highly accelerated life test chamber
With the progress of society, the public's awareness of energy conservation, environmental protection and carbon reduction is increasing, the improvement of battery life, convenient stores to provide battery replacement services and the establishment of charging columns and other favorable conditions, which has prompted the public to accept the purchase of electric locomotives. The general definition of electric locomotives is: Extreme speed of less than 50km/h, on the slope, the maximum slope of the general urban road is about 5 ~ 60 degrees, the underground parking lot is about 120 degrees to the ground, the mountain slope is about 8 ~ 90 degrees, in the case of slope 80 degrees, more than 10 kilometers per hour for the basic needs of electric locomotives. Electric locomotive power system composition is mainly: Power system controller, motor controller, permanent magnet synchronous motor & DC brushless motor, DC power converter, battery management system, car charger, rechargeable battery, etc., Many manufacturers now introduce permanent magnet synchronous motor & DC brushless motor, with low speed and high torque, carbon brush free maintenance, far endurance and other advantages. Both the electric locomotive and the power motor system must meet the Ministry of Transportation light bicycle standards, or relevant regulatory requirements.
Electric locomotive complete vehicle reference specification:
CNS3103 machine bicycle running test method general
CNS3107 machine bicycle acceleration test method
Gb17761-1999 General technical conditions for electric bicycles
JIS-D1034-1999 Test method for braking of motor bicycles
GB3565-2005 Safety requirements for bicycles
Electric locomotive motor or brushless DC motor citation specification:
CNS14386-9 Electric motor bicycle-Test method for power output of motor and controller connection for vehicles
GB/T 21418-2008 Permanent magnet brushless motor system general technical conditions
IEC60034-1 Rating and Performance of rotating motors (GB755)
GJB 1863-1994_ General Specification for brushless DC motors
GJB 5248-2004 General specification for brushless DC motor drivers
GJB 783-1989 micromotor industry standard drive specification
QB/T 2946-2008 Electric bicycle motor and controller
QMG-J52.040-2008 Brushless DC motor
SJ 20344-2002 General specification for brushless DC torque motors
Environmental tests are mainly based on specifications:
IEC60068-2, GJB150
Applicable test equipment:
1.High and low temperature test chamber
2. High and low temperature humidity test chamber
3. Industrial Oven
4. Rapid temperature cycle test chamber
Temperature Cycle Test Specification
Instructions
In order to simulating the temperature conditions encountered by different electronic components in the actual use environment, Temperature Cycling changes the ambient temperature difference range and rapid rise and fall temperature change to provide a more stringent test environment. However, it must be noted that additional effects may be caused to material testing. For the relevant international standard test conditions of temperature cycle test, there are two ways to set the temperature change. First, Lab Companion provides an intuitive setting interface, which is convenient for users to set according to the specification. Second, you can choose the total Ramp time or set the rising and cooling rate with the temperature change rate per minute.
List of International Specifications for Temperature Cycling Tests:
Total Ramp time (min) : JESD22-A104, MIL-STD-8831, CR200315
Temperature variation per minute (℃/min) IEC60749, IPC-9701, Brllcore-GR-468, MIL-2164
Example: Lead-free Solder Joint Reliability Test
Note: In terms of the reliability test of lead-free technetium-free points, different test conditions will be different for the temperature change setting, such as (JEDECJESD22-A104) will specify the temperature change time with the total time [10min], while other conditions will specify the temperature change rate with [10° C/min], such as from 100 °C to 0°C. With a temperature change of 10 degrees per minute, that is to say, the total temperature change time is 10 minutes.
100℃ [10min]←→0℃[10min], Ramp: 10℃/min,6500 cycle
-40℃[5min]←→125℃[5min],Ramp: 10min,
200 cycle check once, 2000 cycle tensile test [JEDEC JESD22-A104]
-40°C(15min)←→125°C(15min), Ramp:15min, 2000 cycle
Example: LED Automotive lighting (High Power LED)
The temperature cycle experimental conditions of LED car lights are -40 °C to 100 °C for 30 minutes, the total temperature change time is 5 minutes, if converted to temperature change rate, it is 28 degrees per minute (28 ° C /min).
Test conditions: -40℃ (30min) ←→100℃ (30min), Ramp: 5min
Instructions:
Early temperature cycle tests only look at the air temperature of the test furnace. At present, according to the requirements of relevant international norms, the temperature variability of the temperature cycle test refers not to the air temperature but the surface temperature of the product to be tested (such as the air temperature variability of the test furnace is 15°C/min, but the actual temperature variability measured on the surface of the product to be tested may only be 10~11°C/min), and the temperature variability that will rise and cool down also needs symmetry, repeatability (the rise and cooling waveform of each cycle is the same), and linear (the temperature change and cooling speed of different loads is the same). In addition, lead-free solder joints and part life assessment in advanced semiconductor manufacturing processes also have many requirements for temperature cycle testing and temperature shock, so its importance can be seen (such as: JEDEC-22A-104F-2020, IPC9701A-2006, MIL-883K-2016). The relevant international specifications for electric vehicles and automotive electronics, their main test are also based on the temperature cycle test of the surface of the product (such as :S016750, AEC-0100, LV124, GMW3172).
Specification for the product to be tested surface temperature cycle control requirements:
1. The smaller the difference between the sample surface temperature and the air temperature, the better.
2. Temperature cycle rise and fall must be over temperature (exceed the set value, but not exceed the upper limit required by the specification).
3. The surface of the sample is immersed in the shortest time. Time (soaking time is different from residence time).
Thermal stress testing machine (TSC)of LAB COMPANION in the temperature cycle test of the product to be tested surface temperature control features:
1. You can choose [air temperature] or [temperature control of the product to be tested] to meet the requirements of different specifications.
2. The temperature change rate can be selected [equal temperature] or [average temperature], which meets the requirements of different specifications.
3. The deviation of temperature variability between heating and cooling can be set separately.
4. Overtemperature deviation can be set to meet the requirements of the specification.
5.[temperature cycle] and [temperature shock] can be selected table temperature control.
IPC requirements for temperature cycle test of products:
PCB requirements: The maximum temperature of the temperature cycle should be 25°C lower than the glass transfer point temperature (Tg) value of the PCB board.
PCBA requirements: The temperature variability is 15°C/min.
Requirements for solder:
1. When the temperature cycle is below -20 °C, above 110 °C, or contains the above two conditions at the same time, more than one damage mechanism may occur to the solder lead welding connection. These mechanisms tend to accelerate each other, leading to early failure.
2. In the process of slow temperature change, the difference between the sample temperature and the air temperature in the test area should be within a few degrees.
Requirements for vehicle regulations: According to AECQ-104, TC3(40°C←→+125°C) or TC4(-55°C←→+125°C) is used in accordance with the environment of the engine room of the car.
Bellcore GR78-CORE is one of the specifications used in early surface insulation resistance measurement (such as IPC-650). The relevant precautions in this test are organized for reference of personnel who need to carry out this test, and we can also have a preliminary understanding of this specification.
Test purpose:
Surface Insulation Resistance Testing
1. Constant temperature and humidity test chamber: the minimum test conditions are 35°C±2°C/85%R.H., 85 ±2°C/85% R.H.
2. Ion migration measurement system: Allowing insulation resistance of the test circuit to be measured under these conditions, a power supply will be able to provide 10 Vdc / 100μA.
Test procedure:
a. The test object is tested after 24 hours at 23°C (73.4° F)/50%R.H. environment
b. Place limited Test patterns on an appropriate rack and keep the test circuits at least 0.5 inches apart, without obstructing air flow, and the rack in the furnace until the end of the experiment.
c. Place the shelf in the center of the constant temperature and humidity test chamber, align and parallel the test board with the air flow in the chamber, and lead the line to outside of the chamber, so that the wiring is far away from the test circuit.
d. Close the furnace door and set the condition to 35 ±2°C, at least 85%R.H. and allow the furnace to spend several hours stabilizing
e. After 4 days, the insulation resistance will be measured and the measured value will be recorded periodically between 1 and 2,2 and 3,3 and 4, 4 and 5 using an applied voltage of 45 ~ 100 Vdc. Under the test conditions, the test is sent out the measured voltage to the circuit after 1 minute. 2 and 4 are periodically at an identical potential. And 5 periodically at opposite potentials.
f. This condition only applies to transparent or translucent materials, such as solder masks and conformal coatings.
g. As for multilayer printed circuit boards required for insulation resistance testing, the only normal procedure will be used for insulation resistance testing circuit products. Extra cleaning procedures are not allowed.
Related test chamber： temperature and humidity chamber
Method of conformity determination:
1. After the electron migration test is completed, the test sample is removed from the test furnace, illuminated from the back and tested at 10 x magnification, and will not be found to reduce the electron migration (filamental growth) phenomenon by more than 20% between the conductors.
2. adhesives will not be used as a basis for republication when determining compliance with the 2.6.11 test method of IPC-TM-650[8] to examine appearance and surface item by item.
Insulation resistance does not meet the requirements of the reasons:
1. Contaminants weld the cells like wires on insulating surface of substrate, or are dropped by water of test furnace (chamber)
2. Incompletely etched circuits will reduce insulation distance between conductors by more than permitted design requirements
3. Chafes, breaks, or significantly damages the insulation between conductors
Burn-in is an electrical stress test that employs voltage and temperature to accelerate the electrical failure of a device. Burn-in essentially simulates the operating life of the device, since the electrical excitation applied during burn-in may mirror the worst-case bias that the device will be subjected to in the course of its use able life. Depending on the burn-in duration used, the reliability information obtained may pertain to the device's early life or its wear-out. Burn-in may be used as a reliability monitor or as a production screen to weed out potential infant mortalities from the lot.
Burn-in is usually done at 125 deg C, with electrical excitation applied to the samples. The burn-in process is facilitated by using burn-in boards (see Fig. 1) where the samples are loaded. These burn-in boards are then inserted into the burn-in oven (see Fig. 2), which supplies the necessary voltages to the samples while maintaining the oven temperature at 125 deg C. The electrical bias applied may either be static or dynamic, depending on the failure mechanism being accelerated.
Figure 1. Photo of Bare and Socket-populated Burn-in Boards
The operating life cycle distribution of a population of devices may be modeled as a bath tub curve, if the failures are plotted on the y-axis against the operating life in the x-axis. The bath tub curve shows that the highest failure rates experienced by a population of devices occur during the early stage of the life cycle, or early life, and during the wear-out period of the life cycle. Between the early life and wear-out stages is a long period wherein the devices fail very sparingly.
Figure 2. Two examples of burn-in ovens
Early life failure (ELF) monitor burn-in, as the name implies, is performed to screen out potential early life failures. It is conducted for a duration of 168 hours or less, and normally for only 48 hours. Electrical failures after ELF monitor burn-in are known as early life failures or infant mortality, which means that these units will fail prematurely if they were used in their normal operation.
High Temperature Operating Life (HTOL) Test is the opposite of ELF monitor burn-in, testing the reliability of the samples in their wear-out phase. HTOL is conducted for a duration of 1000 hours, with intermediate read points at 168 H and 500 H.
Although the electrical excitation applied to the samples are often defined in terms of voltages, failure mechanisms accelerated by current (such as electromigration) and electric fields (such as dielectric rupture) are understandably accelerated by burn-in as well.
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